AMD announces its first mobile processor with AMD 3D V-cache technology

Today, AMD announced the AMD Ryzen 9 7945HX3D processor, a groundbreaking addition to the company’s renowned Ryzen Series of processors and the first mobile processor with AMD 3D V-Cache Technology. The processor will be launched first in the ASUS ROG Scar 17, designed to deliver exceptional performance, and offering the industry’s first integration of AMD 3D V-Cache technology for mobile.

Estimated reading time: 2 minutes

Based on the “Zen 4” architecture, with clock speeds up to 5.4 GHz, and a hyperefficient 55W TDP package, the Ryzen 9 7945HX3D processor is engineered to deliver the top performance needed to handle today’s most demanding titles. Empowering a new era of mobile computing, users will experience immersive, unparalleled gaming performance, and exceptional responsiveness on laptops with state-of-the-art AMD 3D V-Cache technology.

General Specifications

  • Platform: Laptop
  • Product Family: AMD Ryzen™ Processors
  • Product Line: AMD Ryzen™ 9 Processors with Radeon™ Graphics
  • AMD PRO Technologies: No
  • Consumer Use: Yes
  • Commercial Use: No
  • Regional Availability: Global
  • Former Codename: “Dragon Range”
  • Architecture: “Zen 4”
  • # of CPU Cores: 16
  • Multithreading (SMT): Yes
  • # of Threads: 32
  • Max. Boost Clock: Up to 5.4GHz
  • Base Clock: 2.3GHz
  • L1 Cache: 1 MB
  • L2 Cache: 16 MB
  • L3 Cache: 128 MB
  • Default TDP: 55W
  • AMD Configurable TDP (cTDP): 55-75W
  • Processor Technology for CPU Cores: TSMC 5nm FinFET
  • Processor Technology for I/O Die: TSMC 6nm FinFET
  • CPU Compute Die (CCD) Size: 71mm²
  • I/O Die (IOD) Size: 122mm²
  • Package Die Count: 3
  • AMD EXPO™ Memory Overclocking Technology: Yes
  • Precision Boost Overdrive: Yes
  • Curve Optimizer Voltage Offsets: Yes
  • CPU Socket: FL1
  • CPU Boost Technology: Precision Boost 2
  • Instruction Set: x86-64
  • Supported Extensions: AES, AMD-V, AVX, AVX2, AVX512, FMA3, MMX(+), SHA, SSE, SSE2, SSE3, SSE4.1, SSE4.2, SSE4A, SSSE3, x86-64
  • Max. Operating Temperature (Tjmax): 89°C
  • Launch Date: 7/27/2023
  • OS Support:
    • Windows 11 – 64-Bit Edition
    • Windows 10 – 64-Bit Edition
    • RHEL x86 64-Bit
    • Ubuntu x86 64-Bit

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Post Author: BackSpin Chief Editor

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